Fenghua Semiconductor

Fenghua Semiconductor Technology

Fenghua SemiconductorGuangdong Fenghua Semiconductor Technology is a company specializing in the manufacturing, development, marketing, and distribution of electronic components designed for consumer electronics applications. The company's product portfolio includes quad-flat no-leads (QFN) and dual-flat no-leads (DFN) packages, thin shrink small-outline packages (TSSOP), capacitors, inductors, thermistors, varistors, diodes, triodes, and more.

Established in 2000, Guangdong Fenghua Core Technology Co., Ltd. is a holding subsidiary of Foshan Guoxing Optoelectronics Co., Ltd. (stock code 002449). It is recognized as a national high-tech enterprise dedicated to the research, development, production, and sales of semiconductor discrete devices and integrated circuits. Located in Guangzhou Science City, the company operates on a vast scale, covering an area of 30,000 square meters with a factory space of 45,000 square meters. With over 20 internationally advanced semiconductor packaging and testing automation production lines, the company employs over 400 individuals and boasts the capability to produce more than 6 billion discrete semiconductor devices and over 700 million integrated circuits across 20 packaging series and over 1000 varieties.

Fenghua SemiconductorsGuangdong Fenghua Semiconductor Technology adheres to ISO9001, ISO14001, IATF16949, and ISO45001 management systems. Its products have received SNOY GP environmental certification, meeting RoHS environmental standards, REACH environmental requirements, and customer halogen-free specifications. The company holds numerous patents in integrated circuit packaging technology, covering areas such as electrostatic protection devices, core loading machines, tire pressure sensor packaging lead frames, tire pressure sensor pressure calibration methods and equipment, and tire pressure sensor warning methods and systems.

Recognized as one of the first 94 integrated circuit enterprises encouraged by the country to develop, Guangdong Fenghua Semiconductor Technology houses the Guangdong Advanced Microelectronics Packaging and Testing Engineering Technology Research and Development Center. The company is acknowledged as a rapidly growing semiconductor packaging and testing enterprise in China, a specialized, refined, and innovative small and medium-sized enterprise in Guangdong Province, and a demonstration enterprise of integrity in the region. It holds distinctions as a "Famous Brand in Guangdong Province," a "Famous Trademark in Guangdong Province," and is listed among the "Top Ten Famous Brands Recognized for Chinese Transistor Quality."

The company's products and services span the OEM market for home appliances, consumer electronics, computers and peripherals, network communication, automotive electronics, electronic lighting, and IC packaging testing. Adopting a business model that combines standardized and customized services, Guangdong Fenghua Semiconductor Technology provides over 20 types of packaged semiconductor devices and integrated circuit products, including TO, SOT, SOD, SOP, TSSOP, QFN, DFN, and more. The company's current focus is on developing high added value, new green and energy-saving high-power devices, and power management ICs, with an emphasis on expanding towards high-end packaging forms such as QFN, DFN, QFP, LQFP, BGA, CSP, SiP, among others.